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Article Date: 17th June 2020

Armstrong Fluid Technology Launches Design Envelope Evercool™ A New Cooling Solution For Mission Critical Projects

Armstrong, evercool

Armstrong Fluid Technology has announced the launch of Design Envelope EVERCOOL™, a new solution for rapid deployment in mission critical cooling applications.

Design Envelope EVERCOOL™ is an automation platform for mission critical cooling systems. The EVERCOOL™ platform offers pre-engineered, feature-rich options that can be configured on-site. The platform meets the stringent requirements of the Uptime Institute for Tier III data centers, while avoiding the traditional requirements of extensive site programming and customization. EVERCOOL™ reduces site commissioning time by up to 30% and reduces overall energy consumption, coordinating cooling system operation to reduce energy costs by as much as 40%.

EVERCOOL™ uses an innovative design with internal redundancy and a hot-standby controller for continuous uptime. This design approach ensures seamless transfer (in less than 200 milliseconds) between controllers in the event of a failure.

Peter Thomsen, Director, Building Systems Solutions with Armstrong comments, “EVERCOOL™ is a great approach to accelerate project deployment and reduce project costs on any mission critical project, including Tier 1, 2, 3 or 4 data centers.”

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